![High Implementation Reliability Package [Patented Technology]](https://image.mono.ipros.com/public/product/image/515/2000398360/IPROS4409363611273412044.jpg?w=280&h=280)
High Implementation Reliability Package [Patented Technology]
High implementation reliability! Effective for miniaturization and low-profile packaging for automotive applications!
Our company offers a non-lead package with high mounting reliability that utilizes patented technology to improve durability against mechanical stress such as substrate warping and twisting, thanks to a stress-relief material between the leads and the sealing resin. The high mounting strength allows for an alternative to the gull-wing type package, making it effective for miniaturization and low-profile design in automotive applications. 【Features】 ■ Patented technology: Patent No. 2015-139062 (Application date: July 10, 2015) ■ Push strength improved by 57% compared to gull-wing type packages ■ Substrate bending resistance improved by 66% due to the stress-relief material between the leads and sealing resin ■ High mounting reliability *For more details, please refer to the PDF document or feel free to contact us.
- 企業：アルス株式会社 本社工場、第2～第5工場
- 価格：Other
